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Dual 50MHz to 1000MHz High-Linearity,
Serial/Analog-Controlled VGA
Power-Supply Sequencing
The sequence to be used is:
1) Power supply
2) Control lines
Layout Considerations
The pin configuration of the device is optimized to facili-
tate a very compact physical layout of the device and its
associated discrete components. The exposed pad (EP)
the PCB on which the device is mounted be designed
to conduct heat from the EP. In addition, provide the EP
with a low inductance path to electrical ground. The EP
MUST be soldered to a ground plane on the PCB, either
directly or through an array of plated via holes. The lay-
out of the PCB should include proper top-layer ground
shielding to isolate the amplifier’s inputs and outputs
from each other. Shielding between the paths (inputs and
outputs) is important for channel-to-channel isolation.
of the device’s 48-pin TQFN-EP package provides a low
thermal-resistance path to the die. It is important that
Table 4. Typical Application Circuit Component Values
DESIGNATION
C1, C5, C6, C8,
C12, C13
C3, C10
C4, C7, C11,
C14, C16
C15
L1, L2*
R1, R2
U1
QTY
6
2
5
1
2
2
1
DESCRIPTION
1000pF ceramic capacitors (0402)
GRM1555C1H102J
150pF ceramic capacitors (0402)
GRM1555C1H151J
10nF ceramic capacitors (0402)
GRM155R71E103K
1 F F ceramic capacitor (0603)
GRM188R71C105K
820nH inductors (1008)
Coilcraft 1008CS-821XJLC
47.5k I resistors (0402)
48 TQFN-EP (7mm x 7mm)
Maxim MAX2064ETM+
COMPONENT SUPPLIER
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Coilcraft, Inc.
—
Maxim Integrated Products, Inc.
* Select the inductors to ensure that self-resonance of the inductors is outside the band of operation.
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